Efforts to model thermomechanical aspects of the Direct Chip Interconnection (DCI) assembly process are described. DCI is a method to simultaneously attach and electrically interconnect bare chips to a substrate using Anisotropic Conductive Adhesive Films (ACAF). Emphasis has been placed on describing the numerical procedure used in the analysis. The major components of the analysis include a calibration procedure to “numerically measure” anisotropic properties of the film, a curing model to capture “frozen-in” stresses, a global analysis that considers the overall assembly station but does not resolve details of the interconnection, and a local model, coupled to the global model, that resolves details about the interconnection. Typical results are shown to demonstrate the capabilities of the model.

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