Thermal modeling of Surface Mount Technology (SMT) microelectronics packages is difficult due to the complexity of the printed wiring board (PWB) plates through hole (PTH) structure. A simple, yet powerful finite difference based approach, called EPIC (Equivalent Parameter for Interfacial Cells), for modelling complex 2-D and 3-D geometries with multiple materials is used to model the PTH structure. A technique for computing an effective thermal conductivity for the PWB is presented. The results compare favorably with those from a commercially available finite element package but require far less computer time.

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