Recently introduced overmolded pad array chip carrier (OMPAC) electronic packages sometimes suffer from debonding between the overmold material and the printed circuit board. In this study, bond strength is characterized by a combination of experimental and analytical methods. Test specimens representative for OMPAC structures were designed, manufactured, and tested to failure in tension and torsion. Finite element stress analysis of the specimens was performed in conjunction with a combined interfacial stress failure criterion to determine interfacial tensile and shear strengths from the measured failure loads.

This content is only available via PDF.
You do not currently have access to this content.