The effects of chip protrusion on the forced-convection boiling and critical heat flux (CHF) of a dielectric coolant (FC-72) were investigated. The multi-chip module used in the present study featured a linear array of nine, 10 mm x 10 mm, simulated microelectronic chips which protruded 1 mm into a 20-mm wide side of a rectangular flow channel. Experiments were performed in vertical up flow with 5-mm and 2-mm channel gap thicknesses. For each configuration, the velocity and subcooling of the liquid were varied from 13 to 400 cm/s and 3 to 36° C, respectively. The nucleate boiling regime was not affected by changes in velocity and subcooling, and critical heat flux generally increased with increases in either velocity or subcooling. Higher single-phase heat transfer coefficients and higher CHF values were measured for the protruded chips compared to similar flush-mounted chips. However, adjusting the data for the increased surface area and the increased liquid velocity above the chip caused by the protruding chips yielded a closer agreement between the protruded and flush-mounted results. Even with the velocity and area adjustments, the most upstream protruded chip had higher single-phase heat transfer coefficients and CHF values for high velocity and/or highly-subcooled flow as compared the downstream protruded chips. The results show that, except for the most upstream chip, the performances of protruded chips are very similar to those of flush-mounted chips.
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March 1993
Research Papers
Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling
C. O. Gersey,
C. O. Gersey
Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
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I. Mudawar
I. Mudawar
Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
Search for other works by this author on:
C. O. Gersey
Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
I. Mudawar
Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
J. Electron. Packag. Mar 1993, 115(1): 78-88 (11 pages)
Published Online: March 1, 1993
Article history
Received:
May 25, 1992
Revised:
November 17, 1992
Online:
April 28, 2008
Citation
Gersey, C. O., and Mudawar, I. (March 1, 1993). "Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling." ASME. J. Electron. Packag. March 1993; 115(1): 78–88. https://doi.org/10.1115/1.2909305
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