The technique of impedance spectroscopy is suggested for industrial monitoring of solder paste in the surface mount assembly process. Being an on-line implementable technique, it has the potential of giving valuable insight to the manufacturing characteristics of solder paste and can facilitate application of statistical process control methods. This exploratory study evaluates impedance spectroscopy as a monitoring tool and focuses on key topics which can lead to the creation of on-line standards for solder paste. The presented technique is supported by experimental results and statistical analysis.

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