This investigation consisted of an experimental study of the natural convection heat transfer from a square, horizontally oriented electronic component board mounted in a low-aspect-ratio enclosure with a square planform. The component board was simulated by an upward-facing constant heat flux surface. A variety of experiments were performed to determine the effects of systematically varying the enclosure geometry on the maximum surface temperature on the board for two values of the modified Rayleigh number (heater power setting).

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