Mechanical behavior of the contactors in a double-sided “velcro-type” area array connection system is analyzed and discussed. Such a system can be utilized in electronic packaging as an effective high density input/output connector interface. We conclude that low-modulus high-strength metallized polyimides can be regarded as suitable materials for the application in question, while even the strongest metals turn out to be insufficiently flexible and strong to be considered as attractive candidates for super-high-density interconnections.

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