Several surface augmentation techniques were examined in an investigation of enhancement of critical heat flux (CHF) from a simulated electronic chip to a fluorocarbon (FC-72) liquid in a vertical channel. A parametric comparison of boiling performances is presented for a smooth surface and for surfaces with low-profile microgrooves, low-profile microstuds, and high-profile pin fins. Critical heat fluxes as high as 361 W/cm2 were achieved using a combination of moderate flow velocity, high subcooling and surface enhancement. A semiempirical model constructed previously for CHF from a smooth discrete heat source to saturated or subcooled liquid flow, was found successful in correlating CHF data for the three enhanced surfaces.

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