In this analysis we suggest a simple engineering method for the evaluation of the interfacial stresses in elongated bimaterial plates subjected to bending. The taken approach enables one to satisfy the boundary conditions at the plate’s ends within the framework of the elementary beam, or long-and-narrow plate, theory. The analysis is carried out in application to bending on a circular mandrel, which is regarded by many reliability engineers as a suitable test vehicle for the evaluation of the mechanical performance of the attachment material in adhesively bonded and soldered assemblies in electronic packaging.

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