Controlling boiling incipience is of paramount importance for reliable operation of liquid-cooled microelectronic heat sources during power transients. This study focuses on heat transfer from a simulated multichip module to a falling film. Experiments have been performed to develop an understanding of the influence of surface tension and wetting characteristics on sensible heat transfer and boiling incipience in free-falling dielectric (FC-72) liquid films. The boiling results reveal that the vanishingly small contact angle of FC-72 precludes the application of correlations currently employed to predict incipience. Also, the temperature excursion commonly encountered upon boiling incipience in wetting fluids was nonexistent in all the experimental runs.

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