Thermal analysis of forced air cooling of an electronic component is modeled as a two-dimensional conjugate heat transfer problem. The velocity field in a constricted channel is first computed. Then, for a typical electronic module, the energy equation is solved with allowance for discontinuities in the thermal conductivity. Variation of the maximum temperature with the average air velocity is presented. The importance of our approach in evaluating possible benefits due to changes in component design and the limitations of the two-dimensional model are discussed.

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