Just Accepted Manuscript
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Research-Article September 1, 2019
Impact of Overhead Air-Supply Layout on the Thermal Performance of a Container Data Center
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044775 -
Technical Briefs September 1, 2019
Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044774 -
Research-Article September 1, 2019
A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044716 -
Research-Article September 1, 2019
Regional segregation with spatial considerations based analytical filling time model for non-Newtonian power-law underfill fluid in flip-chip encapsulation
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044817 -
Research-Article August 1, 2019
Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044648 -
Research-Article August 1, 2019
Warpage Characterization of Molded Wafer for Fan-out Wafer-level Packaging
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044625 -
Review Articles August 1, 2019
Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044624 -
Research-Article August 1, 2019
Study on Reabsorption Properties of Quantum Dot Color Convertors for LED Packaging
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044475 -
Research-Article August 1, 2019
Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044476 -
Research-Article August 1, 2019
Fatigue Prediction for Molded Wafer Level Package during Temperature Cycling
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044489 -
Research-Article July 29, 2019
EVAPORATIVE WICKING PHENOMENA ON NANOTEXTURED SURFACES
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044373 -
Review Articles July 26, 2019
Packaging for Laser-based White Lighting: Status and Perspectives
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044359 -
Research-Article July 22, 2019
Empirical High Cycle Fatigue Assessment Model of MEMS Devices
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044278 -
Technical Briefs July 22, 2019
Additive-manufactured organic interposers
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044279 -
Research-Article July 17, 2019
Dynamic load balancing using actual workload traces based on central processing unit temperatures
J. Electron. Packag. doi: https://doi.org/10.1115/1.4044262
