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Everyday Heat Transfer Problems: Sensitivities to Governing Variables

By
M. Kemal Atesmen
M. Kemal Atesmen
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ISBN:
9780791802830
No. of Pages:
238
Publisher:
ASME Press
Publication date:
2009

Heat transfer from a surface can be enhanced by using fins. This chapter combines ideas from Chapters 5 and 12, and analyzes the cooling of a chip utilizing a heat sink with rectangular fins.

The temperature of a chip can be analyzed using unsteady-state and one-dimensional heat transfer rate equations in rectangular coordinates. Energy balance for transient heat transfer during the cooling of a chip can be written as follows:  
Change in internal energy of the chip with respect to time=Power generated by the chipEnergy lost from the chip to its heat sink and to the environment by conduction and convection heat transfer
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