Skip Nav Destination
Everyday Heat Transfer Problems: Sensitivities to Governing Variables
ISBN:
9780791802830
No. of Pages:
238
Publisher:
ASME Press
Publication date:
2009
eBook Chapter
13 Cooling of a Chip Utilizing a Heat Sink with Rectangular Fins
Page Count:
9
-
Published:2009
Citation
Atesmen, MK. "Cooling of a Chip Utilizing a Heat Sink with Rectangular Fins." Everyday Heat Transfer Problems: Sensitivities to Governing Variables. Ed. Atesmen, MK. ASME Press, 2009.
Download citation file:
Heat transfer from a surface can be enhanced by using fins. This chapter combines ideas from Chapters 5 and 12, and analyzes the cooling of a chip utilizing a heat sink with rectangular fins.
The temperature of a chip can be analyzed using unsteady-state and one-dimensional heat transfer rate equations in rectangular coordinates. Energy balance for transient heat transfer during the cooling of a chip can be written as follows:
This content is only available via PDF.
You do not currently have access to this chapter.
Email alerts
Related Chapters
Exchangers with Longitudinal-Fin Tubes
Heat Exchanger Engineering Techniques
Air Cooling and Heat Sinks
Thermal Management of Telecommunication Equipment, Second Edition
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition
Thermoelectric Coolers Are Hot
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Related Articles
Spray Cooling of High Aspect Ratio Open Microchannels
J. Heat Transfer (August,2007)
Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
J. Electron. Packag (June,2008)
Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
J. Electron. Packag (September,2000)