Power dissipation in electronic chips is a challenging heat transfer phenomenon, as the chips get smaller and smaller. Most chips or chip sets use copper or aluminum heat sinks to enhance the heat transferred out. These heat sinks are attached in a variety of ways to the chips in order to minimize the thermal resistance between the chip and the heat sink. In this analysis, a chip in the shape of a rectangular box, 10 mm × 10 mm × 0.1 mm, is considered. The chip is attached to its copper heat sink, also in the shape of a rectangular box, 10 mm × 10 mm × 10 mm, by a thermally conductive epoxy of 10 μm thickness.