Skip to Main Content
Skip Nav Destination

Essentials of Electronic Packaging: A Multidisciplinary Approach

By
Puligandla Viswanadham, PhD
Puligandla Viswanadham, PhD
Adjunct Faculty,
University of Texas at Arlington
, Retired Principal Scientist,
Nokia Research Center
, Formerly Senior Member of the Technical Staff, Raytheon-TI Systems, Retired Advisory Engineer, International Business Machines
Search for other works by this author on:
ISBN:
9780791859667
No. of Pages:
388
Publisher:
ASME Press
Publication date:
2011

Electronic packages and assemblies are designed and manufactured with specific objectives with regard to their performance in the user environment. Product expected life is selected at the design stage depending on the use/application environment in which it will operate and the consumer. It also determines the materials' choices and the system robustness. The materials and the processes are selected on the basis of these. Electronic products are categorized on the basis of the industry segments they serve. Table 6.1 gives typical environments and expected product lives for different product categories.

As can be seen from Table 6.1, it contains only...

Introduction
Quality, Reliability, and Assurance
Product Assurance
Qualification
Reliability Statistical Distributions
Normal Distribution
Log-Normal Distribution
Exponential Distribution
Weibull Distribution
Reliability Tests and Qualification
Thermomechanical Stresses
Thermal Cycling
Thermal Shock
High Temperature Storage
Failure Prediction or Estimation Models
Solder Fatigue Model
Humidity Models
Conductive Anodic Filament Model
Suggested Reading
References
Exercises
This content is only available via PDF.
You do not currently have access to this chapter.
Close Modal

or Create an Account

Close Modal
Close Modal