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Essentials of Electronic Packaging: A Multidisciplinary Approach

By
Puligandla Viswanadham, PhD
Puligandla Viswanadham, PhD
Adjunct Faculty,
University of Texas at Arlington
, Retired Principal Scientist,
Nokia Research Center
, Formerly Senior Member of the Technical Staff, Raytheon-TI Systems, Retired Advisory Engineer, International Business Machines
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ISBN:
9780791859667
No. of Pages:
388
Publisher:
ASME Press
Publication date:
2011

Once the product design is accomplished, based on the functionality and operating environment requirements, the components are assembled onto the printed wiring board (PWB). The choice of the package-to-board interconnection scheme also depends on the performance and reliability requirements of the product. It should be amenable for product upgrades, repair, and reworkability (Behun et al., 1997). Several interconnection materials have been in use and include metallurgical systems such as Sn–Pb, Sn–Bi, Sn–Ag–Cu, etc., and conductive adhesives. Some of these are discussed in some detail to provide the fundamentals and essentials.

Introduction
Tin–Lead System
Cu–Sn System
Sn–Ni System
Sn–Au System
Tin–Lead–Silver Alloy System
Lead-Free Interconnection Alloys
Sn–Ag Alloy
Sn–Bi Solder
Sn–Cu Alloy
Au–Sn Solder
Sn–In Solder
Ternary Alloys–Tin–Copper–Silver Alloys
Super Cooling
Solder—Substrate Interface Structure
Interface Nickel–Gold Surface
Kirkendall Voiding
Adhesive Interconnections
Isotropic Conductive Adhesives
Anisotropic Conductive Adhesives
Intrinsically Conductive Adhesives
Interconnection Process/the Assembly
Wave Soldering
Fluxes
Surface Mount Assembly
Stencils
Insertion Mount and Surface Mount Technologies in Perspective
Repair
Rework
Suggested Reading
References
Exercises
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