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More Hot Air
ISBN-10:
079180223X
No. of Pages:
302
Publisher:
ASME Press
Publication date:
2005
eBook Chapter
3 Components and Materials: The Sum of the Parts Is Sometimes Just a Big Hole
Page Count:
2
-
Published:2005
When university labs investigate heat transfer in electronic assemblies, they hardly ever use printed circuit boards and electronic components to represent printed circuit boards and electronic components. Boards are represented by uniform thermal insulators like balsa wood, and components are represented by blocks of aluminum. Why? Quite understandably, the researchers need to simplify the assemblies to make them easier to understand. They are looking for fluid flow and heat transfer phenomena, and they don't want a lot of the details of real electronic components to complicate the picture.
Too bad we can't do the same thing. It would be a...
Chapter 3.1 Not Working Within the Limits
Chapter 3.2 Don't Blow It When Sizing a Fuse
Chapter 3.3 When It's Hot, They All Go in the Pool
Chapter 3.4 Bypass Capacitors?
Chapter 3.5 A Baffling Temperature Rise
Chapter 3.6 24K Gold Heat Sinks: Worth Their Weight in Aluminum
Chapter 3.7 Improving the Weakest Player
Chapter 3.8 Getting Lost in the Cracks
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Related Chapters
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment
Conduction Heat Transfer in a Printed Circuit Board
Everyday Heat Transfer Problems: Sensitivities to Governing Variables
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition
Conclusion
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow
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