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More Hot Air
By
Tony Kordyban
Tony Kordyban
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ISBN-10:
079180223X
No. of Pages:
302
Publisher:
ASME Press
Publication date:
2005

When university labs investigate heat transfer in electronic assemblies, they hardly ever use printed circuit boards and electronic components to represent printed circuit boards and electronic components. Boards are represented by uniform thermal insulators like balsa wood, and components are represented by blocks of aluminum. Why? Quite understandably, the researchers need to simplify the assemblies to make them easier to understand. They are looking for fluid flow and heat transfer phenomena, and they don't want a lot of the details of real electronic components to complicate the picture.

Too bad we can't do the same thing. It would be a lot easier to figure out component temperatures if they were all uniformly sized aluminum blocks. And conduction within the printed circuit board would be a lot easier to calculate if we didn't have all those messy copper traces mixed in with the dielectric.

Chapter 3.1 Not Working Within the Limits
Chapter 3.2 Don't Blow It When Sizing a Fuse
Chapter 3.3 When It's Hot, They All Go in the Pool
Chapter 3.4 Bypass Capacitors?
Chapter 3.5 A Baffling Temperature Rise
Chapter 3.6 24K Gold Heat Sinks: Worth Their Weight in Aluminum
Chapter 3.7 Improving the Weakest Player
Chapter 3.8 Getting Lost in the Cracks
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