9 Thermal Interface Resistance
It is common practice to use brackets, heat sinks, and circuit boards for mounting components that are to be cooled by conduction. The primary heat transfer mode inside a component is also heat conduction. Cooling by conduction often requires the transfer of heat across various materials and interfaces that may be laminated, bolted, riveted, clamped, or bonded together. A high temperature gradient may occur if a large amount of heat is transferred across these interfaces.