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Thermal Management of Microelectronic Equipment, Second Edition

By
L.-T. Yeh
L.-T. Yeh
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ISBN:
9780791861097
No. of Pages:
522
Publisher:
ASME Press
Publication date:
2016

It is common practice to use brackets, heat sinks, and circuit boards for mounting components that are to be cooled by conduction. The primary heat transfer mode inside a component is also heat conduction. Cooling by conduction often requires the transfer of heat across various materials and interfaces that may be laminated, bolted, riveted, clamped, or bonded together. A high temperature gradient may occur if a large amount of heat is transferred across these interfaces.

9.1
Factors Affecting Thermal Contact Resistance
9.2
Joint Thermal Contact Resistance
9.3
Methods of Reducing Thermal Contact Resistance
9.4
Solder and Epoxy Joints
9.5
Practical Design Data
References
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