Front Matter Free

This front matter contains the table of contents, list of figures, list of tables, nomenclature, foreword and preface. This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. eBook keywords: microelectronic devices, electronic packaging, heat conduction, heat transfer, isothermal surfaces, pool boiling, flow patterns, thermal interface resistance, heat sink, heat exchangers.