Skip to Main Content
Skip Nav Destination
Thermal Management of Microelectronic Equipment, Second Edition
By
L.-T. Yeh
L.-T. Yeh
Search for other works by this author on:
ISBN:
9780791861097
No. of Pages:
522
Publisher:
ASME Press
Publication date:
2016

Electronic components mentioned in all previous chapters are generally made from the silicon and are digital devices. On the other hand, the microwave devices are analog in nature. The former coverts the total electrical power input to heat while the heat generated in the latter equals to the difference between the input and output power of the devices. In other words, the energy loss through the analogy device is in the form of heat.

18.1
Gallium Arsenide (GaAs) Chips
18.2
Microwave Modules
18.3
Thermal Management and Technologies Needed
18.4
Reliability and Temperature Cycling
References
This content is only available via PDF.
You do not currently have access to this chapter.
Close Modal

or Create an Account

Close Modal
Close Modal