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Thermal Management of Microelectronic Equipment, Second Edition

By
L.-T. Yeh
L.-T. Yeh
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ISBN:
9780791861097
No. of Pages:
522
Publisher:
ASME Press
Publication date:
2016

Since the invention of an integrated circuit (IC) in the latter part of the 1950s, the progress of development of new integrated circuits has been advanced very rapidly. The chip package that is the housing for the silicon die serves to protect the chip from the environment and to facilitate the handling during the manufacturing process as well as chip interconnection.

10.1
Component
10.2
Printed Circuit Board
References
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