Skip Nav Destination
Thermal Management of Microelectronic Equipment, Second EditionAvailable to Purchase
By
ISBN:
9780791861097
No. of Pages:
522
Publisher:
ASME Press
Publication date:
2016
eBook Chapter
1 Introduction Available to Purchase
Page Count:
14
-
Published:2016
Electronics are becoming a necessity component of the daily life today, and the heart of electronics is the silicon chip. The key elements on a silicon chip as shown schematically in Figure 1.1 include devices (e.g., transistors or capacitors), gates, which generally consist of several devices as a group to perform a specific function, and lines to link blocks of gates.
1.1
Needs for Thermal Control
1.2Reliability and Temperature
1.3Levels of Thermal Resistance
1.4Thermal Design Consideration
1.5Optimization and Life Cycle Cost
1.6Energy Efficiency
1.7Summary
References
This content is only available via PDF.
You do not currently have access to this chapter.
Email alerts
Related Chapters
Spice Model on High Frequency Vibration for CMUT Application
International Conference on Mechanical and Electrical Technology, 3rd, (ICMET-China 2011), Volumes 1–3
Memristor: Bryond Moore's Law and Digital Computing
International Conference on Computer and Electrical Engineering 4th (ICCEE 2011)
Component and Printed Circuit Board
Thermal Management of Telecommunications Equipment
Low Power and Low Area Analog Multiplier Using MiFGMOS
International Conference on Computer and Automation Engineering, 4th (ICCAE 2012)
Related Articles
Thermal Modeling Technique for Multiple Transistors Within Silicon Chip
J. Electron. Packag (December,2011)
Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors
J. Heat Transfer (February,2001)
Nonlinear Dynamics of a Micro-Electro-Mechanical System With Time-Varying Capacitors
J. Vib. Acoust (January,2004)