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Thermal Design of Liquid Cooled Microelectronic EquipmentAvailable to Purchase
By
ISBN:
9780791861936
No. of Pages:
350
Publisher:
ASME Press
Publication date:
2019
eBook Chapter
8. Thermal Design Guide of Liquid Cooled Systems Available to Purchase
By
Page Count:
82
-
Published:2019
In the cooling of electronic equipment, liquid cooling is frequently applied to high power electronic equipment because of its high heat transfer capability. Liquid cooling can further be divided into single- and two-phase flow systems. The latter involves phase change processes such as boiling or condensation that greatly increases the heat transfer capability by utilization of the latent heat of fluids. In addition, the phase change process takes place at the constant temperature under a given pressure.
8.1
Coolant Selection
8.2Figure of Merit (FOM) of Fluids
8.3Classes of Coolants
8.4Useful Heat Transfer Coefficient and Friction Factor Equations
8.5Solutions to Cooling of Electronics
8.6System Thermal Design
8.7General Design Considerations
8.8Liquid Cooled Telecommunication Racks
8.9Liquid Cooled Outdoor Equipment
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