Skip to Main Content
Skip Nav Destination
Thermal Design of Liquid Cooled Microelectronic EquipmentAvailable to Purchase
By
Lian-Tuu Yeh
Lian-Tuu Yeh
Search for other works by this author on:
ISBN:
9780791861936
No. of Pages:
350
Publisher:
ASME Press
Publication date:
2019

In the cooling of electronic equipment, liquid cooling is frequently applied to high power electronic equipment because of its high heat transfer capability. Liquid cooling can further be divided into single- and two-phase flow systems. The latter involves phase change processes such as boiling or condensation that greatly increases the heat transfer capability by utilization of the latent heat of fluids. In addition, the phase change process takes place at the constant temperature under a given pressure.

8.1
Coolant Selection
8.2
Figure of Merit (FOM) of Fluids
8.3
Classes of Coolants
8.4
Useful Heat Transfer Coefficient and Friction Factor Equations
8.5
Solutions to Cooling of Electronics
8.6
System Thermal Design
8.7
General Design Considerations
8.8
Liquid Cooled Telecommunication Racks
8.9
Liquid Cooled Outdoor Equipment
This content is only available via PDF.
You do not currently have access to this chapter.

or Create an Account

Close Modal
Close Modal