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Thermal Design of Liquid Cooled Microelectronic Equipment

By
Lian-Tuu Yeh
Lian-Tuu Yeh
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ISBN:
9780791861936
No. of Pages:
350
Publisher:
ASME Press
Publication date:
2019

In the cooling of electronic equipment, liquid cooling is frequently applied to high power electronic equipment because of its high heat transfer capability. Liquid cooling can further be divided into single- and two-phase flow systems. The latter involves phase change processes such as boiling or condensation that greatly increases the heat transfer capability by utilization of the latent heat of fluids. In addition, the phase change process takes place at the constant temperature under a given pressure.

8.1
Coolant Selection
8.2
Figure of Merit (FOM) of Fluids
8.3
Classes of Coolants
8.4
Useful Heat Transfer Coefficient and Friction Factor Equations
8.5
Solutions to Cooling of Electronics
8.6
System Thermal Design
8.7
General Design Considerations
8.8
Liquid Cooled Telecommunication Racks
8.9
Liquid Cooled Outdoor Equipment
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