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Thermal Design of Liquid Cooled Microelectronic Equipment
By
Lian-Tuu Yeh
Lian-Tuu Yeh
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ISBN:
9780791861936
No. of Pages:
350
Publisher:
ASME Press
Publication date:
2019

This chapter is to review the industry trends of liquid cooled electronics equipment that employ the cooling technologies discussed in Chapter 5. For convenience, the discussion will be broken up into several sections according to the types of electronic equipment.

7.1
Direct Immersion Cooled Chip Packages
7.2
Computing Systems
7.3
Other Types of Systems
7.4
Miniature, Small, and Micro Scale Refrigeration Systems
7.5
Aerospace and Space Systems
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