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Thermal Design of Liquid Cooled Microelectronic Equipment
By
ISBN:
9780791861936
No. of Pages:
350
Publisher:
ASME Press
Publication date:
2019
eBook Chapter
7. Liquid Cooled Microelectronic Equipment
By
Page Count:
41
-
Published:2019
This chapter is to review the industry trends of liquid cooled electronics equipment that employ the cooling technologies discussed in Chapter 5. For convenience, the discussion will be broken up into several sections according to the types of electronic equipment.
7.1
Direct Immersion Cooled Chip Packages
7.2Computing Systems
7.3Other Types of Systems
7.4Miniature, Small, and Micro Scale Refrigeration Systems
7.5Aerospace and Space Systems
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