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Thermal Design of Liquid Cooled Microelectronic Equipment

Lian-Tuu Yeh
Lian-Tuu Yeh
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ASME Press
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In the cooling of electronic equipment, liquid cooling is frequently applied to high power electronic equipment because of its high heat transfer capability. Liquid cooling can further be divided into single- and two-phase flow systems. The latter involves phase change processes such as boiling or condensation that greatly increases the heat transfer capability by utilization of the latent heat. In addition, the phase change process takes place at the constant temperature for a given pressure.

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