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Thermal Design of Liquid Cooled Microelectronic Equipment
By
ISBN:
9780791861936
No. of Pages:
350
Publisher:
ASME Press
Publication date:
2019
eBook Chapter
2. Fundamentals of Convective and Boiling Heat Transfer
By
Page Count:
24
-
Published:2019
In the cooling of electronic equipment, liquid cooling is frequently applied to high power electronic equipment because of its high heat transfer capability. Liquid cooling can further be divided into single- and two-phase flow systems. The latter involves phase change processes such as boiling or condensation that greatly increases the heat transfer capability by utilization of the latent heat. In addition, the phase change process takes place at the constant temperature for a given pressure.
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Related Chapters
Post-CHF Heat Transfer in Flow Boiling
Two-Phase Heat Transfer
Liquid Cooled Systems
Thermal Management of Telecommunications Equipment
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment
Introduction
Two-Phase Heat Transfer
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