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Thermal Design of Liquid Cooled Microelectronic Equipment

By
Lian-Tuu Yeh
Lian-Tuu Yeh
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ISBN:
9780791861936
No. of Pages:
350
Publisher:
ASME Press
Publication date:
2019

Because of advanced developments in circuit and component technologies, the electric circuit becomes more efficient and thus, heat dissipation from an individual device such as transistor is also less as given in Figure 1.1.[1]. Miniaturization of the circuits greatly decreases the size of individual devices, however, and increases the number of circuits integrated on a single chip. The net result is that the chip heat flux (per unit surface area) has significantly increased in the past decades.

1.1
Chip/System Power Density
1.2
Thermal Technology Map
1.3
Reliability and Temperature
1.4
Needs for Liquid Cooled Systems
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