Skip Nav Destination
Thermal Management of Telecommunications Equipment
ISBN:
9780791860205
No. of Pages:
244
Publisher:
ASME Press
Publication date:
2013
eBook Chapter
10 Thermal Management and Energy Efficiency
Page Count:
38
-
Published:2013
The network traffic in telecommunication industry has grown very rapidly every year since its inception. As projected, the network traffic demand will reach tens or hundreds of Tb/s in a couple of years. In response to the projected growth, new design and architecture are needed in order to face the power-density challenges in the next generation telecommunication networks. As pointed out by Vukovic [1], there are two aspects of these issues. One is the network architecture and another is telecommunication equipment design.
10.1 Power Density of Telecommunication Equipment
10.2 Critical Thermal Issues
10.3 Thermal Management and Roadmap
10.4 Thermal Design of Liquid Cooled Telecom Equipment
10.5 Energy Efficiency
10.6 Alternative Energy
10.7 Future Research Needs
10.8 Summary and Conclusion
References
This content is only available via PDF.
You do not currently have access to this chapter.
Email alerts
Related Chapters
Thermal Management and Energy Efficiency
Thermal Management of Telecommunication Equipment, Second Edition
An Improved Neighborhood Structure for Simulated Annlealing Approach to Network Synthesis Problem
International Conference on Mechanical and Electrical Technology, 3rd, (ICMET-China 2011), Volumes 1–3
Presenting a Channel Estimation Method for MIMOOFDM Systems Based on Comparative Methods
International Conference on Computer Technology and Development, 3rd (ICCTD 2011)
Telecom: A Field with Myths and Mistakes All Its Own
More Hot Air
Related Articles
Effects of Servers' Rack Location and Power Loading Configurations on the Thermal Management of Data Center Racks' Array
J. Thermal Sci. Eng. Appl (December,2017)
Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)
J. Heat Transfer (October,2021)
Modular Heat Sinks for Enhanced Thermal Management of Electronics
J. Electron. Packag (June,2021)