Skip Nav Destination
Thermal Management of Telecommunications Equipment
ISBN:
9780791860205
No. of Pages:
244
Publisher:
ASME Press
Publication date:
2013
eBook Chapter
9 Liquid Cooled Systems
Page Count:
36
-
Published:2013
In the cooling of electronic equipment, liquid cooling is frequently applied to high power electronic equipment because of its high heat transfer capability. Liquid cooling can further be divided into single- and two-phase flow systems. The latter involves phase change processes such as boiling or condensation that greatly increases the heat transfer capability by utilization of the latent heat. In addition, the phase change process takes place at the constant temperature.
This content is only available via PDF.
You do not currently have access to this chapter.
Email alerts
Related Chapters
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment
Fans and Air Handling Systems
Thermal Management of Telecommunications Equipment
Liquid Cooled Microelectronic Equipment
Thermal Design of Liquid Cooled Microelectronic Equipment
Comparison of the Availability of Trip Systems for Reactors with Exothermal Reactions (PSAM-0361)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)
Related Articles
Single- and Two-Phase Convective Heat Transfer From Smooth and Enhanced Microelectronic Heat Sources in a Rectangular Channel
J. Heat Transfer (November,1989)
Numerical Simulation of Evaporating Two-Phase Flow in a High-Aspect-Ratio Microchannel with Bends
J. Heat Transfer (August,2017)
Flow Visualization of Submerged Steam Jet in Subcooled Water
J. Heat Transfer (February,2016)