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Thermal Management of Telecommunications Equipment

Editor
Lian-Tuu Yeh
Lian-Tuu Yeh
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Richard C. Chu
Richard C. Chu
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ISBN:
9780791860205
No. of Pages:
244
Publisher:
ASME Press
Publication date:
2013

Since the invention of an integrated circuit (IC) in the latter part of the 1950s, the progress of development of new integrated circuits has been advanced very rapidly. Generally, heat is generated from the transistors on a small, thin, and fragile silicon die or chip inside the package. The chip package that is the housing for the silicon die serves to protect the chip from the environment and to facilitate the handling during the manufacturing process as well as chip interconnection.

2.1 Component
2.2 Printed Circuit Board
References
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