Skip Nav Destination
Thermal Management of Telecommunications Equipment
ISBN:
9780791860205
No. of Pages:
244
Publisher:
ASME Press
Publication date:
2013
eBook Chapter
2 Component and Printed Circuit Board
Page Count:
16
-
Published:2013
Since the invention of an integrated circuit (IC) in the latter part of the 1950s, the progress of development of new integrated circuits has been advanced very rapidly. Generally, heat is generated from the transistors on a small, thin, and fragile silicon die or chip inside the package. The chip package that is the housing for the silicon die serves to protect the chip from the environment and to facilitate the handling during the manufacturing process as well as chip interconnection.
2.1 Component
2.2 Printed Circuit Board
References
This content is only available via PDF.
You do not currently have access to this chapter.
Email alerts
Related Chapters
Component and Printed Circuit Board
Thermal Management of Telecommunication Equipment, Second Edition
Component and Printed Circuit Board
Thermal Management of Microelectronic Equipment, Second Edition
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment
Introduction
Thermal Design of Liquid Cooled Microelectronic Equipment
Related Articles
Special Issue on InterPACK2022
J. Electron. Packag (December,2023)
Thermal Phenomena in Nanoscale Transistors
J. Electron. Packag (June,2006)
Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices
J. Electron. Packag (December,1992)