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International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)

By
Chen Ming
Chen Ming
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ISBN:
9780791859902
No. of Pages:
1400
Publisher:
ASME Press
Publication date:
2011

This paper presents a method for workpiece orientation in robot glueing system based on the robotic 3D laser scanning system. The component of the robotic scanning system, its workflow and the workpiece orientation processes are introduced in detail. The workpiece orientation processes contain the steps as follows: 1) scan the standard workpiece by using the robotic 3D scanning system, and then acquire the scanning model of the standard workpiece (SM_BW);2) scan the current workpiece by using the robotic 3D scanning system, and then acquire the scanning model of the current workpiece (SM_CW);3) register the SM_ BW and SM_CW to position the two model's surfaces (MS) coincide using the Iterative Closest Point (ICP) algorithm; 4) update the robot program for glueing process.

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