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ASME Press Select Proceedings
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)
By
ISBN:
9780791859902
No. of Pages:
1400
Publisher:
ASME Press
Publication date:
2011
eBook Chapter
213 Hot Melt Ink Printing with Focus on Customized Protective Layers for Metal and Silicon Structuring and Sacrificial Molds for Die Fabrication
By
Armin Kain
,
Armin Kain
IMTEK- University of Freiburg
, Department of Microsystems Engineering, Laboratory for Process Technology
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Daniel Härter
,
Daniel Härter
IMTEK- University of Freiburg
, Department of Microsystems Engineering, Laboratory for Process Technology
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Claas Müller
,
Claas Müller
IMTEK- University of Freiburg
, Department of Microsystems Engineering, Laboratory for Process Technology
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Holger Reinecke
Holger Reinecke
HSG-IMIT, Hahn- Schickard- Gesellschaft —,
Institut für Mikro
,- und Informationstechnik
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Page Count:
8
-
Published:2011
Citation
Kain, A, Härter, D, Müller, C, & Reinecke, H. "Hot Melt Ink Printing with Focus on Customized Protective Layers for Metal and Silicon Structuring and Sacrificial Molds for Die Fabrication." International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011). Ed. Ming, C. ASME Press, 2011.
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The purpose of this work is the development of a novel hot melt ink print system, which provides a fast and customerfocused fabrication process for protective layers and sacrificial molds. The used hot melt ink is impermeable to water or other liquids and opaque against light, it can act out as a protective layer against subtractive surface structuring processes or thin and thick film deposition processes. Owing to the forming properties of the used hot melt ink the printing of 3-dimensional objects with an aspect ratio up to 115 was realized. The objects were used as sacrificial molds in combination...
Abstract
Keywords:
Introduction
Material and Setup
Results
Discussion
Conclusion
Acknowledgments
Address
References
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