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ASME Press Select Proceedings

International Conference on Advanced Computer Theory and Engineering (ICACTE 2009)

By
Xie Yi
Xie Yi
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ISBN:
9780791802977
No. of Pages:
2012
Publisher:
ASME Press
Publication date:
2009

The term “packaging” has its role as: 1) Provide I/O connections to the semiconductor devices so the IC is tested and ready for board assembly. This is called IC packaging. 2) Integrate components into systems to form end product systems such as cell phones, PDAs, Laptops. This is called system packaging. Both the above IC and systems packaging are accomplished by interconnections or wiring at the package or board level. In future, the role of packaging is more than interconnections. The IC devices themselves began to integrate more and more transistors and functions, leading to what have been calling SOC or System- on-Chip with multiple systems functions in a single chip. This can be called horizontal or 2D integration of IC blocks toward system-level functionality. Such an approach presents design complexity and fundamental limits for computing, and integration limits for wireless systems. This led to 3-D packaging, often referred to as SIP or System-in-Package. In this review, starting from the introduction of SIP, an alternative approach of product design using SIP is discussed. After that SIP Integration which includes different technology, benefits are considered. Thereafter key issues in SIP integration and its future applications is discussed. Finally this work is compiled in conclusion.

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