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ASME Press Select Proceedings
International Conference on Computer and Electrical Engineering 4th (ICCEE 2011)
By
Jianhong Zhou
Jianhong Zhou
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ISBN:
9780791859841
No. of Pages:
698
Publisher:
ASME Press
Publication date:
2011

A novel ceramic hot-plate with a wire-free bonding was investigated. The devices were made on the popular alumina ceramic flakes with a platinum heater. First results of hotplate including design, Finite Element Method (FEM) simulation, manufacturing and tests are presented in this paper. The measurement results show that the hot-plate has lower power consumption (400 mW at 250 °C) than classical ceramic gas sensors and high working temperatures (600 °C or more) than silicon hot-plate. It is very promising in the application of high temperature gas sensors.

Abstract
Key Words
1 Introduction
2. Design and Fem Simulation
3 Experimental Procedures
4. Results and Discussions
5. Summaries
References
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