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Thermal Management of Microelectronic Equipment

By
L. T. Yeh, Ph.D., P.E.
L. T. Yeh, Ph.D., P.E.
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R. C. Chu, Ph.D., P.E.
R. C. Chu, Ph.D., P.E.
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ISBN-10:
0791801683
No. of Pages:
440
Publisher:
ASME Press
Publication date:
2002

Electronics are the heart of any modern equipment. Thermal control of electronic equipment has long been one of the major areas of application of heat transfer technologies. Many improvements in reliability, power density, and physical miniaturization of electronic equipment over the years can be attributed in part to improved thermal analysis and design of systems. Improved thermal design has been made possible through advances in heat transfer technologies as well as computational methods and tools.

The primary function of cooling systems for electronic equipment is to provide an acceptable thermal environment in which the equipment can operate. To achieve this goal, it is necessary to maintain a thermal path with a minimum resistance from equipment heat sources to the ultimate heat sink.

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