Skip to Main Content
Skip Nav Destination

Thermal Management of Microelectronic Equipment

L. T. Yeh, Ph.D., P.E.
L. T. Yeh, Ph.D., P.E.
Search for other works by this author on:
R. C. Chu, Ph.D., P.E.
R. C. Chu, Ph.D., P.E.
Search for other works by this author on:
No. of Pages:
ASME Press
Publication date:

A heat pipe is a self-contained closed system that transfers heat through boiling and condensation. The heat pipe is a passive device that provides a means to transfer large amounts of heat with relatively small temperature gradients from a single source or multiple sources to heat sinks. However, heat pipes alone cannot cool equipment. In fact, effective cooling of the condenser section of a heat pipe is required to maintain proper heat pipe performance.

A similar device is known as a two-phase thermosyphon. It has the same basic heat transfer mechanism as a heat pipe, but an important difference exists in the mechanism of condensate return in these devices. A heat pipe relies on the capillary action of an internal wick and a working fluid, whereas a thermosyphon employs an external force field such as gravity or centrifugal force for condensate return to the evaporator. Since there is no wick involved, a two-phase thermosyphon is often referred to as a wickless heat pipe.

16.1 Operation Principles
16.2 Useful Characteristics
16.3 Construction
16.4 Operation Limits
16.5 Materials Compatibility
16.6 Operating Temperatures
16.7 Operation Methods
16.8 Thermal Resistances
16.9 Applications
16.10 Micro Heat Pipes
This content is only available via PDF.
You do not currently have access to this chapter.
Close Modal

or Create an Account

Close Modal
Close Modal