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Thermal Management of Microelectronic Equipment

By
L. T. Yeh, Ph.D., P.E.
L. T. Yeh, Ph.D., P.E.
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R. C. Chu, Ph.D., P.E.
R. C. Chu, Ph.D., P.E.
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ISBN-10:
0791801683
No. of Pages:
440
Publisher:
ASME Press
Publication date:
2002

Heat conduction is a process by which heat flows from a region of higher temperature to a region of lower temperature through a solid, liquid, or gaseous medium, or between different media in intimate contact. Generally, heat conduction is due to movement and interaction of molecules. Therefore, a solid is superior to a liquid in transferring heat by conduction because of its shorter distance between molecules. Similarly, a liquid has better thermal conduction characteristics than a gas. Generally, a good conductor of electricity is also a good conductor of heat.

2.1 Fundamental Law of Heat Conduction
2.2 General Differential Equations for Conduction
2.3 One-Dimensional Heat Conduction
2.4 Thermal/Electrical Analogy
2.5 Lumped-System Transient Analysis
2.6 Heat Conduction with Phase Change
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