The Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to scientific computing methods (e.g., modeling, simulation, representation, and algorithm) and computational tools (e.g., high-performance computing, virtual and augmented reality) that aim to improve engineering products and systems for their complete lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, and recycling). The interest areas include computer-aided design and manufacturing, computational geometry and geometry processing, cyber-physical-social systems, data analytics and machine learning, engineering optimization, human–computer interface and human modeling, intelligent manufacturing, machine intelligence and robotics system, modeling and simulation and scientific computing, precision engineering and reverse engineering, sustainability and product lifecycle management, and systems engineering and engineering informatics.
Editor-in-Chief
Yan Wang, Georgia Institute of Technology, USA
Associate Editors
Gaurav Ameta, Siemens Corporate Technology, USA
Nabil Anwer, Ecole Normale Superieure Paris-Sarclay, France
Stephen Baek, University of Virginia, USA
William Bernstein, Air Force Research Laboratory, USA
Linkan Bian, Mississippi State University, USA
Seung-Kyum Choi, Georgia Institute of Technology, USA
Chih-Hsing Chu, National Tsing Hua University, Taiwan
Jonathan Roy Corney, University of Edinburgh, UK
Kaushal Desai, Indian Institute of Technology Jodhpur, India
Ehsan Esfahani, State University of New York at Buffalo, USA
Francesco Ferrise, Politecnico di Milano, Italy
Amir H. Gandomi, University of Technology Sydney, Australia
Johann Guilleminot, Duke University, USA
B. Gurumoorthy, Indian Institute of Science, India
Bin He, Shanghai University, China
Ajay Joneja, Hong Kong University of Science and Technology, Hong Kong
Krishnanand Kaipa, Old Dominion University, USA
Tsz-Ho Kwok, Concordia University, Canada
Vinayak Raman Krishnamurthy, Texas A&M University, USA
Guang Lin, Purdue University, USA
Yusheng Liu, Zhejiang University, China
Yan Lu, National Institute of Standards and Technology, USA
Jianxi Luo, City University of Hong Kong, Hong Kong, China
Yongsheng Ma, Southern University of Science and Technology, China
Samy Missoum, University of Arizona, USA
John G. Michopoulos, Naval Research Laboratory, USA
Duhwan Mun, Korea University, South Korea
Alison Olechowski, University of Toronto, Canada
Yayue Pan, University of Illinois at Chicago, USA
Anurag Purwar, Stony Brook University, USA
P. V. M. Rao, Indian Institute of Technology Delhi, India
Caterina Rizzi, University of Bergamo, Italy
Kazuhiro Saitou, University of Michigan, USA
Shana Smith, National Taiwan University, Taiwan
Yu Song, Delft University of Technology, The Netherlands
Krishnan Suresh, University of Wisconsin, Madison, USA
Atul Thakur, Indian Institute of Technology Patna, India
Wenmeng Tian, Mississippi State University, USA
Cameron Turner, Clemson University, USA
Douglas Van Bossuyt, Naval Postgraduate School, USA
Jun Wang, Nanjing University of Aeronautics and Astronautics, China
Kristina Wärmefjord, Chalmers University of Technology, Sweden
Hui Yang, Pennsylvania State University, USA
Xiaowei Yue, Tsinghua University, China
Zhinan Zhang, Shanghai Jiao Tong University, China
Digital Media Board
Vinayak Raman Krishnamurthy, Texas A&M University, USA
Douglas Van Bossuyt, Naval Postgraduate School, USA
Advisory Board
Jami J. Shah (Founding Editor-in-Chief), Ohio State University, USA
Bahram Ravani (Former Editor-in-Chief), University of California, Davis, USA
Satyandra K. Gupta (Former Editor-in-Chief), University of Southern California, USA
Janet Allen, University of Oklahoma, USA
Imre Horváth, Delft University of Technology, The Netherlands
Ram D. Sriram, National Institute of Standards and Technology, USA
Jianrong Tan, Zhejiang University, China
Guest Editors
Anindya Bhaduri, General Electric Research, USA
Bopaya Bidanda, University of Pittsburgh, USA
Satish Bukkapatnam, Texas A&M University, USA
Qing (Cindy) Chang, University of Virginia, USA
Francisco Chinesta, ENSAM Institute of Technology, France
Bianca Maria Colosimo, Politecnico di Milano, Italy
Elias Cueto, University of Zaragoza, Spain
Tonya Custis, Autodesk, USA
Liang Gao, Huazhong University of Science and Technology, China
Akhil Garg, Huazhong University of Science and Technology, China
Zhaohui Geng, Ohio University, USA
Babak Heydari, Northeastern University, USA
Chen Kan, University of Texas at Arlington, USA
Megan Konar, University of Illinois at Urbana-Champaign, USA
Astrid Layton, Texas A&M University, USA
Dan Li, Clemson University, USA
Chenang Liu, Oklahoma State University, USA
Dehao Liu, Binghamton University, USA
Jie Liu, Carleton University, Canada
Junfeng Ma, Mississippi State University, USA
Zhenguo Nie, Tsinghua University, China
Evangelos Niforatos, Delft University of Technology, The Netherlands
Zhou Quan, University of Birmingham, UK
Sandipp Krishnan Ravi, General Electric Research, USA
Rahul Rai, Clemson University, USA
Zhenghui Sha, University of Texas at Austin, USA
Ziyou Song, National University of Singapore, Singapore
John Steuben, Naval Research Laboratory, USA
Gregory Vogl, National Institute of Standards and Technology, USA
Jian-Xun Wang, University of Notre Dame, USA
Xiaozhi Wang, ABS, USA
Yinan Wang, Rensselaer Polytechnic Institute, USA
Robert Wendrich, Rawshaping Technology, The Netherlands
Paul Witherell, National Institute of Standards and Technology, USA
Mark Yampolskiy, Auburn University, USA
Fan Zhang, Georgia Institute of Technology, USA
Pai Zheng, Hong Kong Polytechnic University, China
Yunbo Zhang, Rochester Institute of Technology, USA
Fiona Zhao, McGill University, Canada
Assistant to the Editor
Regina Neequaye
