The Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to scientific computing methods (e.g., modeling, simulation, representation, and algorithm) and computational tools (e.g., high-performance computing, virtual and augmented reality) that aim to improve engineering products and systems for their complete lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, and recycling). The interest areas include computer-aided design and manufacturing, computational geometry and geometry processing, cyber-physical-social systems, data analytics and machine learning, engineering optimization, human–computer interface and human modeling, intelligent manufacturing, machine intelligence and robotics system, modeling and simulation and scientific computing, precision engineering and reverse engineering, sustainability and product lifecycle management, and systems engineering and engineering informatics.

Editor-in-Chief

Yan Wang, Georgia Institute of Technology, USA

Associate Editors

Gaurav Ameta, Siemens Corporate Technology, USA

Nabil Anwer, Ecole Normale Superieure Paris-Sarclay, France

Stephen Baek, University of Virginia, USA

William Bernstein, Air Force Research Laboratory, USA

Linkan Bian, Mississippi State University, USA

Seung-Kyum Choi, Georgia Institute of Technology, USA

Chih-Hsing Chu, National Tsing Hua University, Taiwan

Jonathan Roy Corney, University of Edinburgh, UK

Kaushal Desai, Indian Institute of Technology Jodhpur, India

Ehsan Esfahani, State University of New York at Buffalo, USA

Francesco Ferrise, Politecnico di Milano, Italy

Amir H. Gandomi, University of Technology Sydney, Australia

Johann Guilleminot, Duke University, USA

B. Gurumoorthy, Indian Institute of Science, India

Bin He, Shanghai University, China

Ajay Joneja, Hong Kong University of Science and Technology, Hong Kong

Krishnanand Kaipa, Old Dominion University, USA

Tsz-Ho Kwok, Concordia University, Canada

Vinayak Raman Krishnamurthy, Texas A&M University, USA

Guang Lin, Purdue University, USA

Yusheng Liu, Zhejiang University, China

Yan Lu, National Institute of Standards and Technology, USA

Jianxi Luo, City University of Hong Kong, Hong Kong, China

Yongsheng Ma, Southern University of Science and Technology, China

Samy Missoum, University of Arizona, USA

John G. Michopoulos, Naval Research Laboratory, USA

Duhwan Mun, Korea University, South Korea

Alison Olechowski, University of Toronto, Canada

Yayue Pan, University of Illinois at Chicago, USA

Anurag Purwar, Stony Brook University, USA

P. V. M. Rao, Indian Institute of Technology Delhi, India

Caterina Rizzi, University of Bergamo, Italy

Kazuhiro Saitou, University of Michigan, USA

Shana Smith, National Taiwan University, Taiwan

Yu Song, Delft University of Technology, The Netherlands

Krishnan Suresh, University of Wisconsin, Madison, USA

Atul Thakur, Indian Institute of Technology Patna, India

Wenmeng Tian, Mississippi State University, USA

Cameron Turner, Clemson University, USA

Douglas Van Bossuyt, Naval Postgraduate School, USA

Jun Wang, Nanjing University of Aeronautics and Astronautics, China

Kristina Wärmefjord, Chalmers University of Technology, Sweden

Hui Yang, Pennsylvania State University, USA

Xiaowei Yue, Tsinghua University, China

Zhinan Zhang, Shanghai Jiao Tong University, China

Digital Media Board

Vinayak Raman Krishnamurthy, Texas A&M University, USA

Douglas Van Bossuyt, Naval Postgraduate School, USA

Advisory Board

Jami J. Shah (Founding Editor-in-Chief), Ohio State University, USA

Bahram Ravani (Former Editor-in-Chief), University of California, Davis, USA

Satyandra K. Gupta (Former Editor-in-Chief), University of Southern California, USA

Janet Allen, University of Oklahoma, USA

Imre Horváth, Delft University of Technology, The Netherlands

Ram D. Sriram, National Institute of Standards and Technology, USA

Jianrong Tan, Zhejiang University, China

Guest Editors

Anindya Bhaduri, General Electric Research, USA

Bopaya Bidanda, University of Pittsburgh, USA

Satish Bukkapatnam, Texas A&M University, USA

Qing (Cindy) Chang, University of Virginia, USA

Francisco Chinesta, ENSAM Institute of Technology, France

Bianca Maria Colosimo, Politecnico di Milano, Italy

Elias Cueto, University of Zaragoza, Spain

Tonya Custis, Autodesk, USA

Liang Gao, Huazhong University of Science and Technology, China

Akhil Garg, Huazhong University of Science and Technology, China

Zhaohui Geng, Ohio University, USA

Babak Heydari, Northeastern University, USA

Chen Kan, University of Texas at Arlington, USA

Megan Konar, University of Illinois at Urbana-Champaign, USA

Astrid Layton, Texas A&M University, USA

Dan Li, Clemson University, USA

Chenang Liu, Oklahoma State University, USA

Dehao Liu, Binghamton University, USA

Jie Liu, Carleton University, Canada

Junfeng Ma, Mississippi State University, USA

Zhenguo Nie, Tsinghua University, China

Evangelos Niforatos, Delft University of Technology, The Netherlands

Zhou Quan, University of Birmingham, UK

Sandipp Krishnan Ravi, General Electric Research, USA

Rahul Rai, Clemson University, USA

Zhenghui Sha, University of Texas at Austin, USA

Ziyou Song, National University of Singapore, Singapore

John Steuben, Naval Research Laboratory, USA

Gregory Vogl, National Institute of Standards and Technology, USA

Jian-Xun Wang, University of Notre Dame, USA

Xiaozhi Wang, ABS, USA

Yinan Wang, Rensselaer Polytechnic Institute, USA

Robert Wendrich, Rawshaping Technology, The Netherlands

Paul Witherell, National Institute of Standards and Technology, USA

Mark Yampolskiy, Auburn University, USA

Fan Zhang, Georgia Institute of Technology, USA

Pai Zheng, Hong Kong Polytechnic University, China

Yunbo Zhang, Rochester Institute of Technology, USA

Fiona Zhao, McGill University, Canada

Assistant to the Editor

Regina Neequaye