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ASTM Selected Technical Papers
Recombination Lifetime Measurements in Silicon
By
D Gupta,
D Gupta
1
Symposium chairman and co-editor
?Mitsubishi Silicon America
?Palo Alto, CA
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FR Backer,
FR Backer
2
Symposium co-chairman and co-editor
?Wacker Siltronic Corp.
?Portland, OR
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W Hughes
W Hughes
3
Symposium co-chairman and co-editor
?MEMC Electronics Materials Inc.
?St. Peters, MO
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ISBN-10:
0-8031-2489-9
ISBN:
978-0-8031-2489-9
No. of Pages:
379
Publisher:
ASTM International
Publication date:
1998
eBook Chapter
Influence of Iron and Copper on Minority Carrier Recombination Lifetime in Silicon
By
A Kempf
,
A Kempf
1
Wacker Siltronic AG
, P.O. Box 1140, D-84479 Burghausen,
Germany
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P Blöchl
,
P Blöchl
1
Wacker Siltronic AG
, P.O. Box 1140, D-84479 Burghausen,
Germany
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A Huber
,
A Huber
1
Wacker Siltronic AG
, P.O. Box 1140, D-84479 Burghausen,
Germany
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F Fabry
,
F Fabry
1
Wacker Siltronic AG
, P.O. Box 1140, D-84479 Burghausen,
Germany
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L Meinecke
L Meinecke
2
Techn. University Clausthal
, Robert-Koch Str. 42, D-38678 Clausthal-Zellerfeld,
Germany
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Page Count:
9
-
Published:1998
Citation
Kempf, A, Blöchl, P, Huber, A, Fabry, F, & Meinecke, L. "Influence of Iron and Copper on Minority Carrier Recombination Lifetime in Silicon." Recombination Lifetime Measurements in Silicon. Ed. Gupta, D, Backer, F, & Hughes, W. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959 : ASTM International, 1998.
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A contamination experiment was carried to prove the possibility of a quantitative determination of the Fe-concentration in the high injection level region for p-type silicon. Calculation factors for two formulas were obtained, one assuming only FeB as life-time killer and another general one. A comparison between DLTS-, SPV- and μ-PCD-results showed a very good correlation of all instruments. Copper was proved to have also a strong influence on lifetime measurement, especially in n-type Silicon. Cu is suspected to affect the efficiency of Oxide passivation. Nitrogen also seemed to have a considerable influence at least in connection with a Cu contamination.
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