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ASTM Selected Technical Papers
Recombination Lifetime Measurements in Silicon
By
D Gupta
D Gupta
1
Symposium chairman and co-editor
?
Mitsubishi Silicon America
?
Palo Alto, CA
Search for other works by this author on:
FR Backer
FR Backer
2
Symposium co-chairman and co-editor
?
Wacker Siltronic Corp.
?
Portland, OR
Search for other works by this author on:
W Hughes
W Hughes
3
Symposium co-chairman and co-editor
?
MEMC Electronics Materials Inc.
?
St. Peters, MO
Search for other works by this author on:
ISBN-10:
0-8031-2489-9
ISBN:
978-0-8031-2489-9
No. of Pages:
379
Publisher:
ASTM International
Publication date:
1998

The influence of transition metals on minority carrier diffusion length in silicon is discussed. It is shown that transition metals easily precipitate on silicon lattice microdefects. These precipitates can not be easily dissolved, which makes gettering procedure ineffective. This conclusion is confirmed by experiments on FZ, CZ and photovoltaic silicon, discussed in this paper. The recombination activity of interstitial copper and its capture cross-section for electrons are determined. The recombination activity of interstitial and precipitated copper and iron are compared. It is shown that the precipitates of copper have much higher recombination activity than the interstitial copper, whereas iron is very active in both precipitated and interstitial form.

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