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ASTM Selected Technical Papers
Elevated Temperature Effects on Fatigue and Fracture
By
RS Piascik,
RS Piascik
1
NASA Langley Research Center
?Hampton, VA 23681-0001
: symposium chairman and editor
.
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RP Gangloff,
RP Gangloff
2
University of Virginia
?Charlottesville, VA 22903
: symposium co-chairman and editor
.
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A Saxena
A Saxena
3
Georgia Institute of Technology
?Atlanta, GA 30332
: symposium session chairman and editor
.
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ISBN-10:
0-8031-2413-9
ISBN:
978-0-8031-2413-4
No. of Pages:
235
Publisher:
ASTM International
Publication date:
1997
eBook Chapter
Analysis of the Intergranular Cracking Process Inside Polycrystalline Heat-Resistant Materials Under Creep-Fatigue Conditions
By
N Tada
,
N Tada
1Department of Engineering Physics and Mechanics,
Graduate School of Engineering, Kyoto University
, Kyoto 606-01,
.Japan
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W Zhou
,
W Zhou
1Department of Engineering Physics and Mechanics,
Graduate School of Engineering, Kyoto University
, Kyoto 606-01,
.Japan
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T Kitamura
,
T Kitamura
1Department of Engineering Physics and Mechanics,
Graduate School of Engineering, Kyoto University
, Kyoto 606-01,
.Japan
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R Ohtani
R Ohtani
1Department of Engineering Physics and Mechanics,
Graduate School of Engineering, Kyoto University
, Kyoto 606-01,
.Japan
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Page Count:
15
-
Published:1997
Citation
Tada, N, Zhou, W, Kitamura, T, & Ohtani, R. "Analysis of the Intergranular Cracking Process Inside Polycrystalline Heat-Resistant Materials Under Creep-Fatigue Conditions." Elevated Temperature Effects on Fatigue and Fracture. Ed. Piascik, R, Gangloff, R, & Saxena, A. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959 : ASTM International, 1997.
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In order to investigate the intergranular failure process in polycrystalline materials under creep-dominant fatigue, numerical simulation of inner small cracks was conducted on the basis of a simple probabilistic model. Although the simulation condition is determined from experimental observation of the cross section of specimens interrupted at different fatigue cycles, the simulation is carried out continuously and reproduces inner cracking behavior throughout the fatigue life. This enables us not only to extract the spatial distribution of inner cracks at arbitrary creep-fatigue cycles, but also to calculate the propagation rate of each inner crack.
References
1.
Ohtani
, R.
, Kitamura
, T.
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, N.
, “Experimental Mechanics on Initiation and Growth of Distributed Small Creep-Fatigue Cracks
,” Recent Advances in Experimental Mechanics
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Kitamura
, T.
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, N.
, and Ohtani
, R.
, “Stochastic Simulation of Initiation and Early Growth of Small Cracks in Creep-Fatigue
,” Probabilistic Structural Mechanics: Advances in Structural Reliability Methods
, Proceedings of IUTAM Symposium, Spanos
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, 1994
, pp. 301–318.3.
Ohtani
, R.
and Kitamura
, T.
, “Initiation and Propagation of Microstructurally Small Cracks under Creep-Fatigue Condition
,” Proceedings
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and Evans
R. W.
, Eds., Institute of Metals
, London
, 1990
, pp. 791–802.4.
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, N.
, Ohtani
, R.
, and Kitamura
, T.
, “Inverse Analysis of Distribution of Internal Small Defects
,” JSME International Journal
, Series A, Vol. 37
, No. 4
, 1994
, pp. 450–455.5.
Johnson
, W. A.
and Mehl
, R. F.
, “Reaction Kinetics in Processes of Nucleation and Growth
,” Transactions of AIME
0096-4778, Vol. 135
, 1939
, pp. 416–458.6.
Kitamura
, T.
, Tada
, N.
, Kuriyama
, Y.
, and Ohtani
, R.
, “Distribution of Grain-Boundary Length and Inclination of Type 304 Stainless Steel and Its Effects on Small Crack Initiation and Growth under Creep-Fatigue Conditions
,” Transactions of JSME
, Vol. 56
, No. 524
, 1990
, pp. 702–707 (in Japanese).7.
Mahin
, K. W.
, Hanson
, K.
, and Morris
, J. W.
Jr., “Comparative Analysis of the Cellular and Johnson-Mehl Microstructures through Computer Simulation
,” Acta Metallurgica
, Vol. 28
, 1980
, pp. 443–453.8.
Tada
, N.
, Kitamura
, T.
, and Ohtani
, R.
, “Monte Carlo Simulation of Creep-Fatigue Small Cracks Based on a Three-Dimensional Model of Random Fracture Resistance of Grain Boundaries
,” Transactions of JSME
, Vol. 56
, No. 524
, 1990
, pp. 708–714 (in Japanese).
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