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ASTM Selected Technical Papers
Semiconductor Processing
By
DC Gupta
DC Gupta
1
Siliconix Inc.
, Symposium Chairman and Editor
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ISBN-10:
0-8031-0403-0
ISBN:
978-0-8031-0403-7
No. of Pages:
686
Publisher:
ASTM International
Publication date:
1984
eBook Chapter
The Impact of Standards on Semiconductor Quality and Manufacturing Efficiency
By
W Murray Bullis
W Murray Bullis
1Dr. Bullis is
Director of Technology
at Siltec Corporation, Silicon Division
, 423 National Avenue, Mountain View, California 94043
.
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Page Count:
10
-
Published:1984
Citation
Murray Bullis, W. "The Impact of Standards on Semiconductor Quality and Manufacturing Efficiency." Semiconductor Processing. Ed. Gupta, D. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959 : ASTM International, 1984.
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Standard specifications and test methods have played critical roles in semiconductor device and integrated circuit manufacture. Voluntary standards have led to “white room” environmental control, silicon wafer availability, and establishment of the merchant processing equipment industry, while military standards have been instrumental in improving IC quality and reliability. Participants in the development of voluntary standards help forge industry consensus on important issues while learning about trends, ideas, and procedures well before they become generally available to the industry. The several organizations now actively developing the standards required by advances in device technology welcome new participants.
References
1.
Cleaning of Electronic Device Components and Material
, ASTM STP 246, American Society for Testing and Materials
, 1958
.2.
Materials and Electron Device Processing
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.3.
Cleaning and Materials Processing for Electronic and Space Apparatus
, ASTM STP 342, American Society for Testing and Materials
, 1962
.4.
“
Clean Room and Work Station Requirements, Controlled Environment
”, Federal Standard
209B, 04
1973
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Anon., “
Standards: 209B Revision: Background and Update
”, Microcontamination
0738-713X, Vol. 1
, No. 1
, June/July 1983, pp. 28-33.6.
Bullis
, W. M.
, “Measurement Methods for the Semiconductor Device Industry — A Review of NBS Activity
”, NBS Tech. Note
511 (12
1969
), pp.24-27.7.
Bullis
, W. M.
, and Ehrstein
, J. R.
, “Reference Materials and the Semiconductor Industry
”, Solid State Technology
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, No. 11
, 11
1981
, pp. 56-65.8.
Bullis
, W. M.
, “Standard Measurements of the Resistivity of Silicon by the Four-Probe Method
”, NBSIR 74-496 (08
1974
).9.
Standards available at the beginning of 1970 are listed in
Bullis
, W. M.
, and Scace
, R. I.
, “Measurement Standards for Integrated Circuit Processing
”, Proceedings of the IEEE
, Vol. 57
, No. 9
, 1969
, pp. 1639-1646.10.
Annual Book of ASTM Standards
, Part 43, issued annually by American Society for Testing and Materials. Beginning in 1983, electronics standards are published by ASTM in two volumes (Vols. 10.04
and 10.05
).11.
Carlson
, J. W.
, “Industry Standardization of Silicon Substrates
”, Solid State Technology
0038-111X, Vol. 16
, No. 9
, 09
1973
, pp. 49-53.12.
This and other silicon standards now appear in
Book of SEMI Standards
, Vol. 3
, Materials, Semiconductor Equipment and Materials Institute
, Mountain View, CA
.13.
Moore
, G. E.
, Sr., and Law
, T.
, “Worldwide Wafer Standardization — Fact or Fancy?
”, Solid State Technology
0038-111X, Vol. 18
, No. 2
, 02
1975
, pp. 40-43.14.
Baylies
, W. A.
, Scace
, R. I.
, and Vieweg-Gutberlet
, F.
, “International Standards for Semiconductor Materials
”, Standardization News
, Vol. 11
, No. 5
, 05
1983
, pp. 21-23.15.
“
Test Methods for Microcircuits
”, MIL-STD-883, 05
1968
; this standard has been revised and reissued several times since its original issuance.16.
“
Line Certification Requirements for Microcircuits
”, NHB 5300.4(3C), 05
1971
(originally issued as NASA-STD-XX6, January 1968).17.
“
Test Methods and Procedures for Microcircuit Line Certification
”, NHB 5300.4(3D), 05
1971
(originally issued as NASA-STD-XX3, January 1968; revised in 1980 and reissued as MIL-STD-977).18.
Reagent Chemicals, American Chemical Society Specifications
, American Chemical Society
, Washington, D.C.
19.
Book of SEMI Standards
, Vol. 1
, Chemicals.20.
Book of SEMI Standards
, Vol. 2
, Equipment.21.
Early
, J. M.
, “Future VLSI Technology: A Review
”, Silicon Processing
, ASTM STP 804, Gupta
D. C.
, Ed., American Society for Testing and Materials
, 1983
, pp. 541-546.22.
Bullis
, W. M.
, “Semiconductor Silicon
”, Standardization News
, Vol. 11
, No. 5
, 05
1983
, pp. 12-15.23.
Francis
, T.
, “Clean Rooms and Contamination Control
”, Standardization News
, Vol. 11
, No. 5
, 05
1983
, pp. 16-18.24.
Douglas
, P.
, “Interconnection Bonding
”, Standardization News
, Vol. 11
, No. 5
, 05
1983
, pp. 24-27.
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