Skip to Main Content
Skip Nav Destination
ASTM Selected Technical Papers
Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings
By
KL Mittal
KL Mittal
1
East Fishkill Facility, IBM Corporation
,
Hopewell Junction, N.Y. 12533
;
symposium chairman and editor
.
Search for other works by this author on:
ISBN-10:
0-8031-0272-0
ISBN:
978-0-8031-0272-9
No. of Pages:
412
Publisher:
ASTM International
Publication date:
1978

A practical definition of “good adhesion” is that the interfacial region (or nearby material) does not fail under service conditions nor at unacceptably low stress levels under test conditions. Adhesion is a macroscopic property that depends on the chemical and mechanical bonding across the interfacial region, the intrinsic stress and stress gradients, and the adhesive failure mode. The failure mode depends on the interfacial structure and the stress to which the interface is subjected. Good adhesion is promoted by: (1) strong bonding across the interfacial region, (2) low stress gradients, either from intrinsic or applied stress, (3) absence of easy fracture modes, and (4) no long-term degradation modes. Adhesion testing must take into account the possible deformation and fracture modes, and a testing program must be devised to test all aspects of adhesion.

1.
Mattox
,
D. M.
, “
Interface Formation and the Adhesion of Deposited Thin Films
,” presented to the 1964 Gordon Research Conference on Adhesion and published as Sandia Laboratories Report SC-R-65-852,
01
1965
(available from National Technical Information Service, U.S. Department of Commerce, Springfield, Va. 22161).
2.
Berry
,
R. W.
,
Hall
,
P. M.
, and
Harris
,
M. T.
in
Thin Film Technology
,
D. Van Nostrand
,
New York
,
1968
, p. 584.
3.
Chapman
,
B. N.
,
Journal of Vacuum Science & Technology
 0022-5355, Vol.
11
,
1974
, p. 108.
4.
Neugebauer
,
C.
,
Handbook of Thin Film Technology
,
Maissel
L.
and
Glang
R.
, Eds.,
McGraw-Hill
,
New York
,
1970
, Chapter 8.
5.
Mattox
,
D. M.
,
Thin Solid Films
 0040-6090, Vol.
18
,
1973
, p. 173.
6.
Lloyd
,
J. R.
and
Nakahara
,
S.
,
Journal of Vacuum Science & Technology
 0022-5355, Vol.
14
,
1977
, p. 655.
7.
Tarng
,
M. L.
and
Wehner
,
G. K.
,
Journal of Applied Physics
 0021-8979, Vol.
43
,
1972
, p. 2268.
8.
Zanghi
,
J. C.
,
Gauch
,
M.
,
Metois
,
J. J.
, and
Masson
,
A.
,
Thin Solid Films
 0040-6090, Vol.
33
,
1976
, p. 193.
9.
Paulson
,
G. G.
and
Friedberg
,
A. C.
,
Thin Solid Films
 0040-6090, Vol.
5
,
1970
, p. 47.
10.
Elliot
,
A. G.
,
Surface Science
 0039-6028, Vol.
51
,
1975
, p. 489.
11.
Sunahl
,
R. C.
,
Journal of Vacuum Science & Technology
 0022-5355, Vol.
9
,
1972
, p. 181.
12.
Westwood
,
W. D.
,
Progress in Surface Science
 0079-6816, Vol.
7
,
1976
, p. 71.
13.
Jennings
,
C. W.
,
Journal of Adhesion
 0021-8464, Vol.
4
,
1972
, p. 25.
14.
Bland
,
R. D.
,
Kominiak
,
G. J.
, and
Mattox
,
D. M.
,
Journal of Vacuum Science & Technology
 0022-5355, Vol.
11
,
1974
, p. 671.
15.
Seah
,
M. P.
,
Surface Science
 0039-6028, Vol.
53
,
1975
, p. 168.
16.
Katz
,
Gerald
,
Thin Solid Films
 0040-6090, Vol.
33
,
1976
, p. 99.
17.
Philofsky
,
Elliot
,
Proceedings
, 9th Annual Reliability Physics Symposium,
Institute of Electrical and Electronics Engineers
, IEEE Catalog No. 71-C-9-Phy.,
1971
, p. 114.
18.
Selikson
,
Bernard
,
Applied Physics Letters
 0003-6951, Vol.
14
,
1969
, p. 283.
19.
Kornelsen
,
E. V.
,
Radiation Effects
 0033-7579, Vol.
13
,
1972
, p. 227.
20.
Dearnaley
,
G.
,
Applied Physics Letters
 0003-6951, Vol.
28
,
1976
, p. 244.
21.
Hollar
,
E. L.
,
Rebarchik
,
F. N.
, and
Mattox
,
D. M.
,
Journal of the Electrochemical Society
 0013-4651. Vol.
117
,
1970
, p. 117.
22.
Mittal
,
K. L.
,
Journal of Vacuum Science & Technology
 0022-5355, Vol.
13
,
1976
, p. 19.
23.
Kasprzak
,
L.
,
Laibowitz
,
R.
,
Herd
,
S.
, and
Ohring
,
M.
,
Thin Solid Films
 0040-6090, Vol.
22
,
1974
, p. 189.
24.
Godwin
,
R. P.
and
Lüscher
,
E.
,
Surface Science
 0039-6028, Vol.
3
,
1964
, p. 42.
25.
Karnowsky
,
M. M.
and
Estill
,
W. B.
,
Review of Scientific Instruments
 0034-6748, Vol.
35
,
1964
, p. 1324.
26.
Mattox
,
D. M.
,
Journal of Applied Physics
 0021-8979, Vol.
37
,
1966
, p. 3613.
27.
Campbell
,
D. S.
,
Handbook of Thin Film Technology
,
Maissel
L.
and
Gland
R.
, Eds.,
McGraw-Hill
,
New York
,
1970
), Chapter 12.
28.
Patten
,
P. W.
,
McClanghan
,
E. D.
, and
Johnston
,
J. W.
,
Journal of Applied Physics
 0021-8979, Vol.
42
,
1971
, p. 4371.
29.
Mattox
,
D. M.
and
Kominiak
,
G. J.
,
Journal of the Electrochemical Society
 0013-4651, Vol.
120
,
1973
, p. 1535.
30.
Röll
,
K.
,
Journal of Applied Physics
 0021-8979, Vol.
47
,
1976
, p. 3224.
31.
Lin
,
D. S.
,
Journal of Physics D: Applied Physics
 0022-3727, Vol.
4
,
1971
, p. 1977.
32.
Jacobson
,
R.
and
Kruse
,
B.
,
Thin Solid Films
 0040-6090, Vol.
15
,
1973
, p. 71.
33.
Smith
,
E.
,
Engineering Fracture Mechanics
 0013-7944, Vol.
6
,
1974
, p. 213.
34.
Pugh
,
S. F.
,
British Journal of Applied Physics
 0508-3443, Vol.
18
,
1967
, p. 129.
35.
Eftis
,
J.
,
Jones
,
D. L.
, and
Liebowitz
,
H.
,
Engineering Fracture Mechanics
 0013-7944, Vol.
7
,
1975
, p. 491.
36.
Proceedings
, Conference on Fundamental Aspects of Stress Corrosion Cracking,
Staehle
R. W.
,
Forty
A. J.
, and
Roozen
D. Van
, Eds.,
National Association of Corrosion Engineers
,
1969
.
37.
Wiederhorn
,
S. M.
and
Bolz
,
L. H.
,
Journal of the American Ceramic Society
 0002-7820, Vol.
53
,
1970
, p. 543.
38.
Kendall
,
K.
,
Journal of Material Science
 0022-2461, Vol.
11
,
1976
, p. 638.
39.
Fractography and Atlas of Fractographs, Metals Handbook
, Vol.
9
, 8th Ed.
American Society for Metals
,
Metals Park, Ohio
,
1974
.
40.
Benjamin
,
P.
and
Weaver
,
C.
,
Proceedings of the Royal Society, Series A: Mathematical and Physical Sciences
, Vol.
255
,
1961
, p. 516.
41.
Jellison
,
J. L.
, “
Kinetics of Thermocompression Bonding of Gold
,” presented to the Institute of Electrical and Electronics Engineers Electronics Components Conference,
San Francisco, Calif.
,
04
1976
, to be published in the
Proceedings
.
42.
Hasselman
,
D. P. H.
,
Journal of the American Ceramic Society
 0002-7820, Vol.
52
,
1969
, p. 600.
43.
Plumbridge
,
W. J.
,
Journal of Materials Science
 0022-2461, Vol.
7
,
1972
, p. 939.
44.
Kolesar
,
S. C.
,
Proceedings
, 12th Annual Reliability Physics Symposium,
Institute of Electrical and Electronics Engineers
, IEEE Catalog No. 74 CH 0839-Phy.,
1974
, p. 155.
45.
Speight
,
J. D.
and
Bill
,
M. J.
,
Thin Solid Films
 0040-6090, Vol.
51
,
1973
, p. 325.
46.
Rehig
,
D. L.
,
Plating and Surface Finishing
 0360-3164, Vol.
61
,
1974
, p. 43.
47.
Frant
,
M. S.
,
Journal of the Electrochemical Society
 0013-4651, Vol.
108
,
1961
, p. 774.
48.
Morrissey
,
R. J.
,
Journal of the Electrochemical Society
 0013-4651, Vol.
119
,
1972
, p. 446.
49.
Mittal
,
K. L.
,
Electrocomponent Science & Technology
 0305-3091, Vol.
3
,
1976
, p. 21.
50.
Butler
,
D. W.
,
Stoddart
,
C. T. H.
, and
Stuart
,
P. R.
,
Journal of Physics D: Applied Physics
 0022-3727, Vol.
3
,
1970
, p. 877.
51.
Almond
,
E. A.
,
May
,
A. T.
, and
Roebuck
,
B.
,
Journal of Material Science
 0022-2461, Vol.
11
,
1976
, p. 568.
52.
The Science of Hardness Testing and Its Research Applications
,
Westbrook
J. H.
and
Conrad
H.
,
, Eds.,
American Society for Metals
,
Metals Park, Ohio
,
1973
, Section 6.
53.
Speight
,
J. P.
,
Gerstenberg
,
D.
, and
Basseches
,
H.
,
Proceedings
, 9th Annual Reliability Physics Symposium,
Institute of Electrical and Electronics Engineers
, IEEE Catalog No. 71-C-9-Phy.,
1971
, p. 195.
54.
Anderholm
,
N. C.
and
Goodman
,
Albert
, “
Method and Apparatus for Measuring Adlhesion of Material Bonds
,” U.S. Patent No. 3,605,486,
20
09
1971
.
55.
Stephens
,
A. W.
and
Vossen
,
J. L.
,
Journal of Vacuum Science & Technology
 0022-5355, Vol.
13
,
1976
, p. 38 (abstract).
56.
Evans
,
A. G.
and
Linzer
,
M.
,
Journal of the American Ceramic Society
 0002-7820, Vol.
56
,
1973
, p. 575.
57.
Mostovoy
,
Sheldon
,
Crosley
,
P. B.
, and
Ripling
,
E. J.
,
Journal of Materials
 0022-2453, Vol.
2
,
1967
, p. 661.
This content is only available via PDF.
You do not currently have access to this chapter.
Close Modal

or Create an Account

Close Modal
Close Modal