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ASTM Selected Technical Papers
Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings
By
KL Mittal
KL Mittal
1
East Fishkill Facility, IBM Corporation
, Hopewell Junction, N.Y. 12533
; symposium chairman and editor
.
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ISBN-10:
0-8031-0272-0
ISBN:
978-0-8031-0272-9
No. of Pages:
412
Publisher:
ASTM International
Publication date:
1978
Description
Twenty-Five papers review and asses current measurement techniques, define problem areas and galvanize increased interest in developing better and more veritable techniques for adhesion measurement for thin films, thick films, and deposits and coatings.
Mittal, K.
Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings. ISBN-10: 0-8031-0272-0
ISBN: 978-0-8031-0272-9
No. of Pages: 412
ISBN (electronic): 978-0-8031-5546-6
Publisher: ASTM International
Published: 1978
Download citation file:
Table of Contents
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IntroductionByKL MittalKL Mittal1East Fishkill Facility, IBM Corporation,Hopewell Junction, N.Y. 12533;symposium chairman and editor.Search for other works by this author on:
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Adhesion Measurement: Recent Progress, Unsolved Problems, and ProspectsByKL MittalKL Mittal1Staff engineer,East Fishkill Facility, International Business Machines Corporation.Hopewell Junction, N. Y.12533.Search for other works by this author on:
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Locus of Failure and Its Implications for Adhesion MeasurementsByRJ GoodRJ Good1Professor, Department of Chemical Engineering,State University of New York at Buffalo,Buffalo, N. Y. 14214.Search for other works by this author on:
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Problems in Adhesion MeasurementByJJ BikermanJJ Bikerman1Adjunct professor, Department of Chemical Engineering,Case Western Reserve University,Cleveland, Ohio 44106.Search for other works by this author on:
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Experimental Methods to Determine Locus of Failure and Bond Failure Mechanism in Adhesive Joints and Coating-Substrate CombinationsByWL BaunWL Baun1Research chemist,Air Force Materials Laboratory,Wright-Patterson Air Force Base, Ohio 45433.Search for other works by this author on:
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Thin-film Adhesion and Adhesive Failure—A PerspectiveByDM MattoxDM Mattox1Division supervisor, Surface Metallurgy,Sandia Laboratories,Albuquerque, N. Mex. 87115.Search for other works by this author on:
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Use of Fracture Mechanics Concepts in Testing of Film AdhesionByWD Bascom,WD Bascom1Head, Adhesion and Polymer Composites Section, Polymeric Materials Branch, head, Ceramic Processing and Characterization Section, Ceramics Branch, research chemist, Adhesion and Polymer Composites Section, Polymeric Materials Branch, and head, Surface Analysis Section, Surface Chemistry Branch, respectively,Naval Research Laboratory,Washington, D.C. 20375.Search for other works by this author on:PF Becher,PF Becher1Head, Adhesion and Polymer Composites Section, Polymeric Materials Branch, head, Ceramic Processing and Characterization Section, Ceramics Branch, research chemist, Adhesion and Polymer Composites Section, Polymeric Materials Branch, and head, Surface Analysis Section, Surface Chemistry Branch, respectively,Naval Research Laboratory,Washington, D.C. 20375.Search for other works by this author on:JL Bitner,JL Bitner1Head, Adhesion and Polymer Composites Section, Polymeric Materials Branch, head, Ceramic Processing and Characterization Section, Ceramics Branch, research chemist, Adhesion and Polymer Composites Section, Polymeric Materials Branch, and head, Surface Analysis Section, Surface Chemistry Branch, respectively,Naval Research Laboratory,Washington, D.C. 20375.Search for other works by this author on:JS MurdayJS Murday1Head, Adhesion and Polymer Composites Section, Polymeric Materials Branch, head, Ceramic Processing and Characterization Section, Ceramics Branch, research chemist, Adhesion and Polymer Composites Section, Polymeric Materials Branch, and head, Surface Analysis Section, Surface Chemistry Branch, respectively,Naval Research Laboratory,Washington, D.C. 20375.Search for other works by this author on:
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Techniques for Measuring Adhesive Energies in Metal/Ceramic SystemsByLE MurrLE Murr1Professor and head, Department of Metallurgical and Materials Engineering,New Mexico Institute of Mining and Technology,Socorro, N. Mex. 87801.Search for other works by this author on:
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Adhesion of Thin Plasma Polymer Films to PlasticsByLW Crane,LW Crane1Staff associate and member of technical staff, respectively,Science Center, Rockwell International,Thousand Oaks, Calif. 91360.Search for other works by this author on:CL HamermeshCL Hamermesh1Staff associate and member of technical staff, respectively,Science Center, Rockwell International,Thousand Oaks, Calif. 91360.Search for other works by this author on:
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Electromagnetic Tensile Adhesion Test MethodByS KrongelbS Krongelb1Research staff member,Thomas J. Watson Research Center, International Business Machines Corporation,Yorktown Heights, N.Y. 10598.Search for other works by this author on:
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Measurements of Film-Substrate Bond Strength by Laser SpallationByJL VossenJL Vossen1Member of technical staff,David Sarnoff Research Center, RCA Laboratories,Princeton, N.J. 08540.Search for other works by this author on:
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Hardness and Adhesion of Filmed Structures as Determined by the Scratch TechniqueByJ Ahn,J Ahn1Advisory engineer,International Business Machines Corporation,San Jose, Calif. 95193.Search for other works by this author on:KL Mittal,KL Mittal2Staff engineer, East Fishill Facility,International Business Machines Corporation,Hopewell Junction, N.Y. 12533.Search for other works by this author on:RH MacQueenRH MacQueen3Senior associate engineer,International Business Machines Corporation,Poughkeepsie, N.Y. 12602.Search for other works by this author on:
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Threshold Adhesion Failure: An Approach to Aluminum Thin-Film Adhesion Measurement Using the Stylus MethodByJ Oroshnik,J Oroshnik1Physicist,U.S. Naval Weapons Engineering Support Activity,Washington Navy Yard, Washington, D.C. 20374; presently on assignment to theNaval Research Laboratory,Washington, D.C. 20375.Search for other works by this author on:WK CrollWK Croll2Cherryfield Stoneware,Cherryfield, Me. 04622.Search for other works by this author on:
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Adhesion of Granular Thin FilmsByR FaureR Faure1Ingenieur au Centre National de la Recherche Scientifique Centre d'Etudes des Couches Minces, Laboratoire associe, C.N.R.S., Universite d'Aix-Marseille Ill,13397 MarseilleCedex 4,.FranceSearch for other works by this author on:
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Adhesion Measurement on Thin Evaporated FilmsByK Kuwahara,K Kuwahara1Professor, assistant, and graduate student, respectively, Faculty of Engineering,Hiroshima University,Hiroshima,.JapanSearch for other works by this author on:H Hirota,H Hirota1Professor, assistant, and graduate student, respectively, Faculty of Engineering,Hiroshima University,Hiroshima,.JapanSearch for other works by this author on:N UmemotoN Umemoto1Professor, assistant, and graduate student, respectively, Faculty of Engineering,Hiroshima University,Hiroshima,.JapanSearch for other works by this author on:
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Adhesion Measurements on Thick-Film ConductorsByTT HitchTT Hitch1Member of the technical staff,David Sarnoff Research Center, RCA Laboratories, Princeton,New Jersey 08540.Search for other works by this author on:
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Evaluation of Methods for Performing Adhesion Measurements of Thick-Film Terminations on Chip ComponentsByGJ EwellGJ Ewell1Head, Inorganic Materials Section,Technology Support Division, Hughes Aircraft Company,Culver City, Calif. 90230.Search for other works by this author on:
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Adhesion Measurement Technique for Soldered Thick-Film ConductorsBySS LevenSS Leven1Engineer, Westinghouse Electric Corporation,Defense and Electronic Systems Center,Baltimore, Md. 21203.Search for other works by this author on:
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Adhesion of Flame-Sprayed CoatingsByHS Ingham, JrHS Ingham, Jr1Manager, R&D Department,METCO Inc.,Westbury, N.Y. 11590.Search for other works by this author on:
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Adherence Measurements and Evaluation of Thick-Film Platinum-GoldByS SchroterS Schroter1Senior chemist, Microwave and Power Tube Division,Industrial Components Operation, Raytheon Company,Quincy, Mass. 02169.Search for other works by this author on:
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Adhesion Testing of Deposit-Substrate CombinationsByJW Dini,JW Dini1Members of technical staff,Sandia Laboratories,Livermore, Calif. 94550.Search for other works by this author on:HR JohnsonHR Johnson1Members of technical staff,Sandia Laboratories,Livermore, Calif. 94550.Search for other works by this author on:
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Methods for Evaluating Adhesion of Photoresist Materials to Semiconductor DevicesByCA DeckertCA Deckert1Member of the technical staff,RCA Laboratories,Princeton, N. J. 08540.Search for other works by this author on:
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Effect of Aspect Ratio on Tensile Bond Strength for Butt Joint of Internal Fracture—Theoretical and Experimental AnalysisByM Masuoka,M Masuoka1Bachelor of science and doctor of science, respectively,Osaka Prefectural Industrial Research Institute,Enokojima Kamino-cho, Nishiku, Osaka 550,.JapanSearch for other works by this author on:K NakaoK Nakao1Bachelor of science and doctor of science, respectively,Osaka Prefectural Industrial Research Institute,Enokojima Kamino-cho, Nishiku, Osaka 550,.JapanSearch for other works by this author on:
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Measuring the Temperature Dependence of the Strength of Metal-Polymer JointsByNI Egorenkov,NI Egorenkov1Head of laboratory and professor, respectively,Institute of Mechanics of Metal-Polymer Systems of the Byelorussian Academy of Sciences,Gomel,U.S.S.R.Search for other works by this author on:VA BelyiVA Belyi1Head of laboratory and professor, respectively,Institute of Mechanics of Metal-Polymer Systems of the Byelorussian Academy of Sciences,Gomel,U.S.S.R.Search for other works by this author on:
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Peel Test for Determining the Adhesion of Electrodeposits on Metallic SubstratesByOJ Klingenmaier,OJ Klingenmaier1Senior research chemist and senior research technician, respectively,Electrochemistry Department, Research Laboratories, General Motors Corporation,Warren, Mich. 48090.Search for other works by this author on:SM DobrashSM Dobrash1Senior research chemist and senior research technician, respectively,Electrochemistry Department, Research Laboratories, General Motors Corporation,Warren, Mich. 48090.Search for other works by this author on:
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© 1978
ASTM International
