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Journal Articles

Competing Fracture of Thin-Chip Transferring From/Onto Prestrained Compliant Substrate

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Huimin Liu, Zunxu Liu, Zhoulong Xu, Zhouping Yin, YongAn Huang, Jiankui Chen
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. October 2015, 82(10): 101012.
Paper No: JAM-15-1271
https://doi.org/10.1115/1.4031047
Published Online: July 30, 2015
View Articletitled, Competing Fracture of Thin-Chip Transferring From/Onto Prestrained Compliant Substrate
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Needles, Stress, Tension
Journal Articles

Thermomechanical Analysis of Film-on-Substrate System With Temperature-Dependent Properties

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YongAn Huang, ZhouPing Yin, YouLun Xiong
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. July 2010, 77(4): 041016.
https://doi.org/10.1115/1.4000927
Published Online: April 16, 2010
View Articletitled, Thermomechanical Analysis of Film-on-Substrate System With Temperature-Dependent Properties
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Topics: Buckling, Temperature, Thermomechanics, Thin films