The 7th International Congress on Thermal Stresses will take place at National Taiwan University of Science and Technology (NTUST) in Taipei, Taiwan, from June 4–7, 2007. Abstracts are now being sought for sessions which will be organized to cover most areas of Thermal Stresses as well as Heat Transfer.
The Congress website www.ntust.edu.tw/~ts2007 provides detailed information and will be updated periodically. For further information or questions, please send an e-mail to ts2007@mail.ntust.edu.tw
The principal topics of interest are:
Thermal Stresses and Deformations
Thermoelasticity and Viscoelasticity
Thermoplasticity and Viscoplasticity
Thermal Stresses in Fracture and Fatigue
Thermoelastic Contact Problems
Active and Passive Control in High Temperature Structures
Thermal Shock
Engineering Approaches to High/Low Temperature Design
Anisotropic Thermomechanical Problems
Thermal Stresses in Dynamic Problems
Inverse and Optimization Methods for Thermal Problems
Thermal Stresses in Materials and Forming Processes
Thermal Stresses in Electronic Packaging
Thermal Stress Problems in Industrial Applications
Thermal Stresses in Welding
Heat Conduction and/or Radiation Problems
Computational Methods in Thermal Problems
Experimental Methods in Thermal Stresses
Instability and Localization Under Thermomechanical Loadings
Thermodynamics in Porous Media
Coupled Thermal and Electromechanical Effects
Thermal Problems at Moving Interfaces
Abstracts should be submitted by November 15, 2006, preferably by uploading to the website. Note that the abstracts of the papers to be presented at the Congress will be published in a Proceedings volume and distributed to all attendees.
We look forward to seeing you in Taipei!
General Chair:
Ching-Kong Chao, National Taiwan University of Science and Technology
Co-Chairs:
Richard B. Hetnarski, Rochester Institute of Technology, USA
Naotake Noda, Shizuoka University, Japan
Secretary:
Chyi-Yeu Lin, National Taiwan University of Science and Technology
