Thermomechanical Coupling in Solids

Bui, H. D.; Nguyen, Q. S.; Mura, T.

doi:10.1115/1.3173714

Thermomechanical Coupling in Solids

H. D. Bui, Editor ,

H. D. Bui, Editor

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Q. S. Nguyen, Editor ,

Q. S. Nguyen, Editor

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T. Mura, Reviewer

Department of Civil Engineering, Northwestern University, Evanston, IL 60208

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T. Mura, Reviewer

Department of Civil Engineering, Northwestern University, Evanston, IL 60208

J. Appl. Mech. Jun 1988, 55(2): 500 (1 pages)

https://doi.org/10.1115/1.3173714

Published Online: June 1, 1988

Thermomechanical Coupling in Solids

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Thermomechanical Coupling in Solids

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