An analytical model is derived for the delamination of a thin film from a rigid substrate by a cylindrical shaft with a flat end and finite radius. We show that, within certain limitations, a point-load model can be applied to the system, to give simple relations between the film-substrate energy of adhesion and the measured variables of applied shaft force, blister height, and blister radius. The results are applicable to systems where a finite size cylindrical shaft or disk generates delamination of the film from the substrate.
Issue Section:
Technical Brief
References
1.
Birringer
, R. P.
, Shaviv
, R.
, Besser
, P. R.
, and Dauskardt
, R. H.
, 2012
, “Environmentally Assisted Debonding of Copper/Barrier Interfaces
,” Acta Mater.
, 60
(5
), pp. 2219
–2228
.2.
Boddeti
, N. G.
, Koenig
, S. P.
, Long
, R.
, Xiao
, J.
, Bunch
, J. S.
, and Dunn
, M. L.
, 2013
, “Mechanics of Adhered, Pressurized Graphene Blisters
,” ASME J. Appl. Mech.
, 80
(4
), p. 040909
.3.
Zhu
, T.
, Li
, G.
, Müftü
, S.
, and Wan
, K.-T.
, 2017
, “Revisiting the Constrained Blister Test to Measure Thin Film Adhesion
,” ASME J. Appl. Mech.
, 84
(7
), p. 071005
.4.
Wan
, K.-T.
, and Mai
, Y.-W.
, 1995
, “Fracture Mechanics of a Shaft-Loaded Blister of Thin Flexible Membrane on Rigid Substrate
,” Int. J. Fract.
, 74
(2
), pp. 181
–197
.5.
Wan
, K. T.
, and Liao
, K.
, 1999
, “Measuring Mechanical Properties of Thin Flexible Films by a Shaft-Loaded Blister Test
,” Thin Solid Films
, 352
(1–2
), pp. 167
–172
.6.
Wan
, K.-T.
, Guo
, S.
, and Dillard
, D. A.
, 2003
, “A Theoretical and Numerical Study of a Thin Clamped Circular Film Under an External Load in the Presence of a Tensile Residual Stress
,” Thin Solid Films
, 425
(1–2
), pp. 150
–162
.7.
Wang
, J.
, Sorescu
, D. C.
, Jeon
, S.
, Belianinov
, A.
, Kalinin
, S. V.
, Baddorf
, A. P.
, and Maksymovych
, P.
, 2016
, “Atomic Intercalation to Measure Adhesion of Graphene on Graphite
,” Nat. Commun.
, 7
, p. 13263
.8.
Zong
, Z.
, Chen
, C.-L.
, Dokmeci
, M. R.
, and Wan
, K.-T.
, 2010
, “Direct Measurement of Graphene Adhesion on Silicon Surface by Intercalation of Nanoparticles
,” J. Appl. Phys.
, 107
(2
), p. 026104
.9.
Xiangyang
, G.
, Xiyu
, Y.
, Buxuan
, L.
, Shangchun
, F.
, and Cheng
, L.
, 2017
, “Measuring Graphene Adhesion on Silicon Substrate by Single and Dual Nanoparticle‐Loaded Blister
,” Adv. Mater. Interfaces
, 4
(9
), p. 1601023
.10.
Wood
, J. D.
, Harvey
, C. M.
, and Wang
, S.
, 2017
, “Adhesion Toughness of Multilayer Graphene Films
,” Nat. Commun.
, 8
(1
), p. 1952
.11.
Lii-Rosales
, A.
, Han
, Y.
, Evans
, J. W.
, Jing
, D.
, Zhou
, Y.
, Tringides
, M. C.
, Kim
, M.
, Wang
, C.-Z.
, and Thiel
, P. A.
, 2018
, “Formation of Multilayer Cu Islands Embedded Beneath the Surface of Graphite: Characterization and Fundamental Insights
,” J. Phys. Chem. C
, 122
(8
), pp. 4454
–4469
.12.
Zhou
, Y.
, Lii-Rosales
, A.
, Kim
, M.
, Wallingford
, M.
, Jing
, D.
, Tringides
, M. C.
, Wang
, C.-Z.
, and Thiel
, P. A.
, 2018
, “Defect-Mediated, Thermally-Activated Encapsulation of Metals at the Surface of Graphite
,” Carbon
, 127
, pp. 305
–311
.Copyright © 2018 by ASME
You do not currently have access to this content.
